High quality printed circuit board assembly manufacturer? Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layers MCPCB, etc. At the same time, we purchased many advanced, art-of-state machines & devices for PCB manufacturing, checking, to improve the quality of our boards. Discover even more details on pcb assembly. Capability: We are continued to improve our MCPCB, FR4 PCB & FPC & Ceramic PCB manufacturing level to get satisfactory result from customers and ourselves.
Double sided flex circuits consists with double sided copper conductors and can be connected from both sides. It allows more complicated circuit designs, more components assembled. The major material used are copper foil, polyimide and coverlay. Adhesiveless stack up is popular for better dimensional stability, high temperature, thinner thickness. Dual access flexible circuit board refer to the flex circuit which can be accessed from both top and bottom side but only has only layer of conductor trace. Copper thickness 1OZ and coverlay 1mil, it similar with 1 layer FPC and opposite side FFC. There’re coverlay openings on both sides of flex circuit so that there’re solderable PAD on both top and bottom sides, that is similar with double sided FPC, but dual access flex circuit board has different stack up because of only one copper trace, so no plating process is need to make plated through hole (PTH) to connect between top and bottom side, and trace layout is much more simple.
Heavy Copper Board does not have a set of definition per IPC. According to PCB industry, however, peopel generally use this name to identify a printed circuit board with copper conductors 3 oz/ft2 – 10 oz/ft2 in inner and/or outer layers. And Extreme heavy copper PCB refers to 20 oz/ft2 to 200 oz/ft2 printed circuit board. Heavy copper normally used for a various products but not limited to: high power distribution, heat dissipation, planar transformers, power convertors, and so on.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Discover additional information at bstpcb.com.
Sometimes people will use abbreviation “MCPCB”, instead of the full name as Metal Core PCB, or Metal Core Printed Circuit Board. And also used different word refers the core/base, so you will also see different name of Metal Core PCB, such as Metal PCB, Metal Base PCB, Metal Backed PCB, Metal Clad PCB and Metal Core Board and so on. MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components. This is achieved by using a Thermally Conductive Dielectric Layer.
